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高端灌封胶 您当前的位置：首页 》航空航天 》高端灌封胶 |
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高导热有机硅灌封胶
特性：符合UL94 V0 认证，低模量，低粘度，高导热 (0.7-3.2w/mk)，满足多种导热灌封的需求，
用于充电模块、电源模块灌封、各类传感器灌封等。
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有机硅灌封胶
NSG-005，NSG-009，NSG-015，NSG-032，NSG-040
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Property
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NSG-005
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NSG-009
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NSG-015
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NSG-032
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NSG-021
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NSG-040
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Viscosity, cps
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4000
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3500
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4000
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20000
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7500
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-
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Gravity, g/ml
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1.5
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1.66
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2.56
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3.1
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2.6
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3.2
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Setting
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Excellent
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Good
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Excellent
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Excellent
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Good
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Good
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Working Life, min
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60
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30
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60
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40
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30
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30
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Curing time, min@80C
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30
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30
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30
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30
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30
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30
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Thermal Conductivity, W/mK
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0.7
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1
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1.5
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3.2
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2.1
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4.0
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Hardness, Shore A
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60
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45
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60
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60
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65
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75
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Tensile Strength, Mpa
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1.48
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0.34
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0.78
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2.1
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0.8
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-
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Reparability
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Good
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Excellent
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Excellent
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Excellent
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Excellent
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Excellent
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Manufacture Site
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Shanghai
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Shanghai
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Shanghai
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Shanghai
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Shanghai
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Shanghai
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